Co-packaged optics (CPO) integrates photonic components directly with electronic switches to enable high-bandwidth, low-power 10G and higher optical interconnects, offering a key solution for next-generation data centers.

Overview of Co-Packaged Optics (CPO)

Co-packaged optics (CPO) is an advanced optical interconnect architecture that places photonic integrated circuits (PICs) and lasers directly alongside switching ASICs or processors within the same package, drastically reducing the electrical I/O distance and improving energy efficiency, bandwidth density, and signal integrity . By collapsing electrical paths from inches to millimeters, CPO minimizes insertion loss, reduces latency, and lowers power consumption, which is critical for AI data centers and high-performance computing (HPC) environments .

10G Optical Interconnects in CPO

While CPO is often discussed in the context of 400G, 800G, and 1.6T links, the same principles apply to 10G optical interconnects, particularly for smaller-scale or legacy systems. Integrating 10G photonics directly with switch ASICs allows:

• Lower power per bit due to reduced electrical driver requirements
• Improved signal integrity by minimizing copper trace lengths
• Compact packaging suitable for dense server racks or edge computing nodes Technologies such as micro ring resonators (MRRs), through-silicon vias (TSVs), and femtosecond laser-written waveguides enable high-density integration of 10G photonics while maintaining compatibility with CMOS processes .

Implications for Hungary

Although specific deployments in Hungary are not detailed in the sources, the country's growing semiconductor and photonics ecosystem could benefit from CPO adoption. Hungary hosts several electronics and photonics research centers and has a skilled workforce in microelectronics, making it a potential site for CPO integration and 10G optical interconnect development. Local data centers and AI infrastructure could leverage CPO to:

• Reduce energy consumption in high-density server clusters
• Enable low-latency, high-bandwidth interconnects for AI and HPC workloads
• Support future upgrades to higher-speed optical links while maintaining backward compatibility with 10G systems

Future Trends

Industry trends indicate that CPO adoption will accelerate globally, driven by AI and 6G network demands. Key developments include:

• Integration of photonic memory and neuromorphic photonics for energy-efficient computing
• Non-volatile phase-change materials (PCMs) to reduce thermal crosstalk and static power
• Heterogeneous integration combining PICs and electronic ICs for scalable, low-latency interconnects For Hungary, this suggests that 10G CPO could serve as a stepping stone toward higher-speed optical interconnects, supporting both local and regional AI and HPC deployments. In summary, Hungary's potential in co-packaged photonics for 10G lies in leveraging CPO technology to enhance data center efficiency, reduce latency, and prepare for future high-speed optical networks, aligning with global trends in AI-driven optical interconnects .